Mouser Electronics premieres its latest instalment of the Empowering Innovation Together (EIT) series unveiling the transformative potential of digital therapeutics.
Harwin announces that its Kona high-power connector series is now available with backshells. Made from an aerospace-grade aluminium 6061 alloy, these backshells will prevent unwanted EMI from leaking out from the connector/cable assembly into the surrounding system.
Analog Devices, Inc. celebrates its more than $1 billion investment to expand its semiconductor wafer fab in Beaverton, Oregon.
The ZED-F9P GNSS module provides engineers with precise, cm-level accuracy for industrial navigation, with high update rates and low power consumption, making the ZED-F9P GNSS module ideal for dynamic applications like unmanned autonomous vehicles (UAV) and robotics.
Smiths Interconnect announced the launch of its new high-frequency surface mount resistive and Wilkinson dividers in the DC 50GHz frequency range.