SICK has released its new IO-Link Wireless Gateway, revolutionising industrial communications and providing access to sensor data without the need for cables.
BAUMER continues to expand its extensive ‘Toolbox’ range of high-performing sensors following the introduction of new edge sensors, the OE60 and OE40.
Danisense is enhancing its R&D capabilities with the integration of new state-of-the-art winding machines into its rapid prototyping setup.
Micro-Epsilon has extended its range of 2D/3D measurement systems with the 3D Profile Unit (3DPU), a powerful computer platform that enables the calculation and profile stitching of up to eight individual profiles from the scanCONTROL 30xx series of laser profile sensors into a common coordinate system.
Micro-Epsilon has updated its non-contact laser distance sensor portfolio with a unit that is even more robust than its predecessor and measures distances up to 150m, with an accuracy of < ± 1mm.