The move to complex distributed computing brings with it some high level technical issues: IT security, greatly aggravated by the inherent need to open up previously closed production systems; the need for high levels of IT system reliability, the repeatable low system latency requirements and stability needed for critical machine-to-machine communication and the need to maintain the integrity of production processes. The distributed mini-systems will often have embedded IP capability, Wi-Fi and Bluetooth connectivity, processing and communicating information from their attached sensors and controls throughout the IoT rather than raw signals going back to a central control room.
In addition to these macro level concerns, at the micro level the widespread distribution of electronic modules and sub-systems into the factory environment requires considerable thought to be given to the selection of the housing for the electronics.
Given that the selected enclosure must provide a secure and physically robust environment for the electronics, there are several criteria to consider when choosing the optimum product design.
Read the full article in the October issue of DPA