Master Bond has introduced a high-performance bonding, sealing, coating and encapsulation system called EP21TDC-2LO. This formulation offers high flexibility and excellent toughness, curing at room temperatures or more rapidly at elevated temperatures. It has a 1:3 mix ratio by weight or volume and has a working life of >90 minutes for a 100gm. mass. EP21TDC-2LO is easy to apply. Little exotherm is developed during cure making it suitable for use in thick as well as in thin sectioned configurations.
Master Bond EP21TDC-2LO meets NASA low outgassing specifications. It exhibits outstanding electrical insulation properties and superior thermal conductivity. It is durable and adheres well to both similar and dissimilar substrates. EP21TDC-2LO has a service operating temperature range of 4K to 250°F. It also features exceptional thermal shock resistance.