Feature

Encapsulated multi-layer actuators with improved heat dissipation

PI Ceramic now offers encapsulated actuators with improved heat dissipation properties. A casting compound that does not impair the actuator displacement replaces the inert gas in the hollow space between the metal bellows and piezo actuator.

20/04/2014 14:24:58

Additional cooling of the stainless steel casing - using compressed air or water, for example - can support heat dissipation from the dynamically operating actuator.

This enables working frequencies to be achieved that are ten times higher than with an actuator without casting compound (the P-885.95 can be run at 3.5kHz over the full travel range of 36µm, for example).

These multi-layer piezo actuators are available in sizes Ø 11.2mm × 40.5 mm for 30µm travel, and Ø 11.2 mm × 22.5mm for 14µm travel.

Higher forces can be achieved with a version measuring Ø 18.6 mm × 22.5mm providing a minimal displacement to 14µm. For these dimensions, the actuators with casting compound are available at short notice.

The actuators can be manufactured in other sizes to order.

Written By Sophia Bell

Sophia Bell is the Group Editor of DPA, Connectivity, and PBSI. She joined the team in 2020 as Assistant Editor after achieving a First-Class Honours BA in English Literature and Film Studies from the University of East Anglia. In her current role, she leads the editorial strategy, driving digital growth and ensuring each title continues to deliver trusted, relevant insight for engineering and manufacturing professionals.