Schroff has introduced a range of complete systems to meet the requirements
of the PICMG MicroTCA standard, which defines a system architecture that
allows AdvancedMC mezzanine boards to be plugged directly into a backplane
without a carrier board.
Ideally suited to telecommunications and networking applications, Schroff's
MicroTCA systems offer a flexible and modular design with the potential to
replace proprietary solutions and reduce development costs.
The systems consist of a chassis, a 200mm-deep board cage (available in 2U
and 4U heights and various widths), a MicroTCA Carrier Hub (optionally two
for redundant operation), power modules with selectable redundancy and load
distribution, a cooling unit (optionally redundant) and a backplane. The
backplane is configured in star topology with high-speed connections
suitable for a variety of protocols, and up to 12 AdvancedMC modules can be
accommodated.
With effective thermal management playing a key role in these
high-performance systems, Schroff has developed a hybrid solution combining
water and air cooling in the chassis. Critical components are cooled
directly with water cooling units, while the heat generated by the remaining
components is expelled using conventional air cooling techniques. The
cooling fluid distribution system is located above and below the board cage,
with the inlet and outlet pipes routed to drip-free valves in the front
panels of the plug-in units.
The MicroTCA complete systems comply with the strict noise limits laid down
in both the ETSI (European Telecom Standard Institute) standard and the US
NEBS standard (Network Equipment Building Standard).
In addition to its wide range of subracks, cases and cabinets, Schroff also
offers a comprehensive system integration service that enables customers to
reduce overheads and product development times by outsourcing some or all of
their design and manufacturing activities.