Schroff has developed a new 64-Bit range of CompactPCI backplanes with Rear I/O for CompactPCI systems with horizontal board assembly that conform to PICMG 2.0 Rev. 3.0.
The Backplanes for 6 U CompactPCI hotswapable boards are available as 2, 4, 6 and 8 slot versions (1, 2, 3 and 4 U). They are constructed as continuous monolithic 9 U backplanes, with an integrated 3 U wide area for plug-in 3 U/8 HP power supplies with P47 connectors.
Through the monolithic solution the effort of cabling between the power backplane and the CompactPCI backplane, the voltage loss of cables and connectors can be avoided. As standard there are one or two connection possibilities (P47 connectors) on the 19in CompactPCI power supplies, which can operate in parallel or redundantly.
With the backplane for 3 U systems it is possible to connect three power supplies and with the 4 U systems even four connections for CompactPCI power supplies can be realised. The network connectors are below P1, in order to reduce the voltage loss further.
The FAL/DEG signals of the power supplies are routed separately to a connector to make them accessible from the outside. Additionally the signals are grouped and fed to the systems slot for evaluation by the CPU board. A possible power supply failure is registered by the CPU board and definite measures can be initiated immediately. The system slot is located at the bottom left, which allows to use double width CPUs (8 HP).
Apart from the usual connectors for CompacPCI backplanes from Schroff, such as utility and IPMB, further connectors for the connection of a fan tray and various temperature sensors are available. Space saving in the bottom area of the backplane makes it possible to run ribbon cables from the Rear Transition Module to possible hard discs (3.5in) which can be integrated into a CompactPCI system in unoccupied power supply slots.
In a 4 U system this allows to accommodate e.g. one power supply and three hard discs or two power supplies and two hard discs. The power supply of the hard discs is carried out via power connectors on the rear of the backplane. For the connection of further components power bugs for 5 V, 3,3 V, ± 12 V and V I/Os with 3,3 or 5 V are also arranged in the lower part of the backplane.
The backplanes are arranged as ten-layer multi-layer boards with ceramic capacitors in SMD technology. The geographic address of the backplane is determined, but can easily be changed by the user with SMD Zero Ohm resistors.