Zuken is introducing an important new bridging technology to the CADSTAR design suite - CADSTAR BoardModeler Lite. This technology provides an optimized environment for the verification of the PCB layout in its mechanical environment. BoardModeler Lite creates a bridge between the ECAD and MCAD world using the industrial formats which are in common use in the MCAD world, namely ACIS, STEP, and STL format.
Zuken has a considerable array of R&D expertise at its design centres in Japan, Germany and the UK and this technology was initially developed as BoardModeler for its high end applications. However Zuken, recognising the needs of the PCB designer working in an ECAD-MCAD environment, has brought BoardModeler Lite into the CADSTAR design suite for use by PCB Designer and Engineer alike.
Through BoardModeler Lite the designer can access and import/export ACIS, STEP, STL during the design process. Visualization, measurement and on-line design rule checking capabilities allow the electrical design to be checked against the mechanical requirements. This allows the PCB layout to be checked in the earliest stages of the design process. Component placement changes, board outline and height limitation areas are automatically back annotated into the PCB design.
BoardModeler Lite replaces CADSTAR 3D offering an enhanced 3D environment to ensure that the PCB design fits the mechanical product design. This latter feature is a key benefit for products with complex case (housing) designs and limited height or space available for the electrical components.
The designer can easily undertake on-line collision checks as BoardModeler Lite indicates when the PCB design causes a problem with the imported housing, other PCB boards and other mechanical geometries (such as heatsinks). Using visual overview the designer monitors where problems are occurring. As each new constraint is added or altered the knock-on results are shown immediately saving important design and manufacturing time.
Zuken has also launched E3.3DRoutingBridge, an interface between commonly used MCAD systems and E3.series. The enhanced technology facilitates data exchange between E3.series designs and 3D Harness Design Systems with an all new user interface, single installation and added functionality.
E3.3DRoutingBridge sends electrical data, such as device designation, component information and interconnection logic from E3.series to the mechanical CAD system and in turn, receives structural information such as wire length and take off locations. Overall functionality is dependent upon the MCAD system in use and typically includes bend radius checks, collision control, placement of fixings and more. Standard file transfer formats include XML, ASCII, or CSV. Integrating the electrical components into the 3D model at the start of the design ensures a more effective process and addresses time-to-market issues.
E3.3DRoutingBridge will be available in June for Siemens NX, CATIA V5 and SolidWorks design systems. Interfaces for ProEngineer, Inventor, SolidEdge, NX I-deas and LANDMARK are due to follow in the near future.