There has been renewed interest in the use of isotropic conductive adhesives (ICAs) as a solder replacement, with the impending restrictions on the use of lead in products such as solder. In response, the NPL has undertaken a study to review and investigate potential test regimes to assess both the process quality and field reliability of ICA joints subjected to a variety of environmental and mechanical conditions. The initial work is published in a report (DECP-MPR 005)