Working in collaboration with a partner company, electronics packaging specialist Schroff has developed a new self-adhesive fabric gasket with a triangular profile that has been granted a patent by the European Patent office. Specifically designed for narrow gaps, the new gasket profile is now being used on shielded versions of Schroff’s range of AdvancedMC modules, which are compatible with both AdvancedTCA and MicroTCA systems.
Previously, gaskets with a semicircular profile were generally used for electromagnetic sealing between modules, but the high physical forces that occur during insertion and removal made the gaskets susceptible to damage.
The geometry of the new gasket overcomes this problem by virtue of its sharper edges and a reduction in the amount of filler material required, resulting in lower shear forces that are insufficient to deform or tear the gasket.
Compatible with PICMG AMC.0 RC1.1 and RC1.2, Schroff’s comprehensive range of standard AMC modules includes single and double height versions, as well as compact, mid-size and full-size widths.