Feature

More strength with less stress: Reliably reinforcing BGAs

No one likes stress. But stress is not just unpleasant for people, it can also have negative effects on increasingly complex chip packages soldered onto circuit boards as integrated functional units and installed in various devices.

02/04/2024 12:43:08

Nearly every device in the world has semiconductor chips. This extends far beyond consumer electronics. Whether in smartphones, cars, kitchen appliances or data centres, these complex mini computers are everywhere. Chips or chip assemblies are fitted with solder balls on the underside for electrical contact, which are then attached via reflow soldering during the production of their respective boards. To protect the chips from environmental influences, they are also usually overmoulded with epoxy materials.

Following the trend of smart devices and the Internet of Things, these mini-computers are becoming more powerful with the packages themselves becoming larger. This poses new challenges for the stress-free reinforcement of packages on circuit boards.

Read the full article in DPA's April issue

Written By Sophia Bell

Sophia Bell is the Group Editor of DPA, Connectivity, and PBSI. She joined the team in 2020 as Assistant Editor after achieving a First-Class Honours BA in English Literature and Film Studies from the University of East Anglia. In her current role, she leads the editorial strategy, driving digital growth and ensuring each title continues to deliver trusted, relevant insight for engineering and manufacturing professionals.