Nearly every device in the world has semiconductor chips. This extends far beyond consumer electronics. Whether in smartphones, cars, kitchen appliances or data centres, these complex mini computers are everywhere. Chips or chip assemblies are fitted with solder balls on the underside for electrical contact, which are then attached via reflow soldering during the production of their respective boards. To protect the chips from environmental influences, they are also usually overmoulded with epoxy materials.
Following the trend of smart devices and the Internet of Things, these mini-computers are becoming more powerful with the packages themselves becoming larger. This poses new challenges for the stress-free reinforcement of packages on circuit boards.
Read the full article in DPA's April issue