The new WaferMax Z precision vertical lift stage from Aerotech utilises
direct drive, linear motor technology to achieve a positioning resolution
of 0.83nm for applications such as laser machining and semiconductor
wafer inspection. It features a low profile wedge and base, secured in a
preloaded cross roller bearing arrangement with integral linear motor and
precision encoder. With a 5mm travel range, the complete stage is just
50mm high and has a footprint of 250x210mm (including connectors).
Positioning accuracy is +/-1.5um.