Kemtron is now distributing the PolarChip range of thermal interface
materials manufactured by W L Gore. These highly compressible, thermally
conductive materials are suitable for filling air gaps between heat
generating devices on PCBs and the heat sinks, heat spreaders and metal
chassis that ultimately dissipate the heat. Polarchip is an expanded PTFE
matrix filled with boron nitride particles. The material is soft and
pliable, and physically robust.