TDK-Lambda's EFE Series of embedded frontend power supplies delivers strong power density, high efficiency and enhanced reliability. The first products in the range are the 300W EFE-300 and the 400W EFE-400 single output supplies that deliver 133% peak power capability for 10 seconds and offer efficiency of up to 90%.
The EFE Series employs an 8-bit microcontroller for full digital control of the output and to handle housekeeping routines. Power densities of up to 22W/in³ are achieved under peak load conditions and 16.6W/in³ under continuous loading.
TDK-Lambda’s European marketing director, Martin Southam, commented: "This is the breakthrough that marks a new inflexion point in the power supply industry. Our Uk design team have created revolutionary core IP that will spread rapidly across our product roadmap".
Compact dimensions and a 1U profile (the EFE-300 is 127mm x 76mm x 34mm and the EFE-400 is 152mm x 76mm x 34mm) allow the EFE Series to be incorporated in designs where space is limited, so end equipment can be smaller, cooler and more feature rich. Typical markets include broadcast, instrumentation and industrial, and other applications, such as ATE, automation, routers, servers and security networks.
The new digitally controlled power supplies incorporate many innovative design features including an integrated magnetics transformer that increases efficiency by up to 1%. The digital control allows the power supply’s performance, such as current limit and start-up characteristics, to be optimised. A low cost primary side control topology is used, supervised by the microcontroller. This results in fewer parts and higher efficiency without sacrificing load regulation performance. Furthermore, the need for an opto-isolator is eliminated - a device which is undesirable for long life power supply designs.
TDK-Lambda UK’s advanced development manager, Andrew Skinner, commented: "Many of the design features of the EFE Series directly enhance reliability. For example, having precise control of abnormal situations through proprietary algorithms prevents device overstress. In addition, better circuit noise immunity is achieved compared to analogue designs, and the substantial parts count reduction allows for more optimised component spacing leading to improved thermal performance".