Smiths Interconnect’s solutions to ever-increasing demand for rugged, high-speed connections in space

Space architectures are continuing to follow the trend of either daughter card to backplane or point-to-point system designs. The highest degree of flexibility is typically achieved using a point-to-point approach, as seen in frame slice and SpaceWire or SpaceFibre architectures.

To meet this need, Smiths Interconnect has developed an advanced ultra-high-density, high-speed interconnect solution: the NXS series, specifically designed and tested for critical space applications, which satisfies both point-to-point and backplane connector
requirements. 

The system offers a reliable way to implement high-density interconnections with high-speed signal transmission requirements, enabling a scalable satellite design. 

The NXS series combines controlled impedance differential pair signals together with the ability to add customizable modules. 

All of this is possible with solderless board mounting. This technology will revolutionise the way in which spacecraft are designed and built by providing an unparalleled level of signal density and flexibility.

The NXS
series not only meets the requirements, but exceeds them: indeed, recent tests have proven that the NXS system can withstand data rate application up to 50Gbps per bay requirements including extreme levels of vibration, shock, and climatic testing above 2,100G. 

NXS is equipped with the Hypertac hyperboloid contact technology at the interface, ensuring the highest level of performance and reliability for critical applications. 

Multiple linear contact paths give low contact resistance which remains
stable over the lifetime of the equipment which is vital for space applications. 

Along with long-term reliability, the Hyperboloid contact has low insertion and extraction forces, giving high durability and long life, as well as an immunity to shock and vibration. 

The NXS interface contact, named ‘Micro-boloid’, has a male pin of nominal diameter 0.4mm. Its compact dimensions are designed for optimal signal density, whilst also being compatible with typical shielded twinax
cable, PCB layout design and isolation between modules. 

Each product is engineered using 3D Electromagnetic Simulation (EM) software to provide excellent performance in a total thin film process.

NXS is built to the highest space standards and qualified to rigorous testing and performance criteria:? ESCC 3401, ESCC 3402, ECSS-Q-ST-70C, ECSS-Q-ST-70-02, ECSS-Q-ST-70-08C, ECSS-Q-ST-70-38C and ECSS-Q-70-71. 

While the space market is constantly evolving, Smiths Interconnect has the product and software capability to provide solutions to meet the challenges that this demanding environment presents, ensuring reliability and cutting-edge connectivity.