Feature

Ensuring electronic devices’ reliability through non-destructive testing of speciality materials

Manufacturers of high-end semiconductor electronic products used in consumer, industrial and military applications have long relied on precise testing methodologies to identify the location of defects, such as voids and cracks, and the delamination of different layers within a microelectronic device, also known as a chip.

04/04/2022 11:55:55

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Scanning acoustic microscopy (SAM), a non-invasive and non-destructive ultrasonic testing method, has become an industry standard to detect and analyse flaws during various chip production steps and in the final quality inspection
after packaging.

In addition, SAM is often utilised to identify a specific root-cause failure mechanism when a device fails during use.

Today's electronics products contain various speciality metals, alloys, plastics, and glass components.
All semiconductor components need to be enclosed and packaged in consumer-usable form factors. As a result, SAM equipment has evolved and is now being used to detect subsurface flaws, dis-bonds, cracks, and
other irregularities in these types of materials that constitute “packaging” of semiconductor components.

With the same rigour of failure analysis and quality testing used for semiconductors now being applied to metals and alloys,
both the production yield and overall reliability of electronic devices have improved significantly. Projects are completed in less time, while eliminating potential points of failure in the field.

Read the full article in the April issue of DPA

Written By Sophia Bell

Sophia Bell is the Group Editor of DPA, Connectivity, and PBSI. She joined the team in 2020 as Assistant Editor after achieving a First-Class Honours BA in English Literature and Film Studies from the University of East Anglia. In her current role, she leads the editorial strategy, driving digital growth and ensuring each title continues to deliver trusted, relevant insight for engineering and manufacturing professionals.