Tasked with fitting powerful components into compact spaces without compromising on performance, engineers must perform a difficult balancing act. Increased power means a greater heat output, which can cause some electronics to overheat. This is a business-critical challenge, particularly in industries such as aerospace and automotive, where electronics must withstand harsh environmental conditions and fluctuations in airflow and temperature.
To overcome these challenges, engineers must be ever more careful when testing and managing the heat dissipation of their designs. This means an increase in demand for powerful thermal simulation tools that can simulate heat transfer accurately, at an ever more granular level.
To achieve this at speed, however, takes significant power, something which typically requires an investment in on-site hardware...
Read the full article in the March issue of DPA