Feature

Why thermal simulation software is moving to the cloud

Today’s technologies enter the market faster than ever, as companies focus on launching new products and improving existing models ahead of their competition. Nowhere is this breakneck speed of innovation more keenly felt than in the electronics industry, where electronics engineers are under pressure to deliver sleek and slender designs that feature high-powered, high-functioning software.

01/03/2022 14:46:07

Tasked with fitting powerful components into compact spaces without compromising on performance, engineers must perform a difficult balancing act. Increased power means a greater heat output, which can cause some electronics to overheat. This is a business-critical challenge, particularly in industries such as aerospace and automotive, where electronics must withstand harsh environmental conditions and fluctuations in airflow and temperature.

To overcome these challenges, engineers must be ever more careful when testing and managing the heat dissipation of their designs. This means an increase in demand for powerful thermal simulation tools that can simulate heat transfer accurately, at an ever more granular level.

To achieve this at speed, however, takes significant power, something which typically requires an investment in on-site hardware...

Read the full article in the March issue of DPA

Written By Sophia Bell

Sophia Bell is the Group Editor of DPA, Connectivity, and PBSI. She joined the team in 2020 as Assistant Editor after achieving a First-Class Honours BA in English Literature and Film Studies from the University of East Anglia. In her current role, she leads the editorial strategy, driving digital growth and ensuring each title continues to deliver trusted, relevant insight for engineering and manufacturing professionals.