Feature

NXS Series, new ultra-high-density, space-qualified interconnect

Smiths Interconnect has announced the release of its new NXS Series, the ultra-high density interconnect specifically designed and tested for critical space flight applications.

15/11/2021 16:24:05

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Today, space satellites are moving away from RF Analog-based payloads, providing low-speed telecommunication signalling, to a new Digital Transparent Processor architecture for high-throughput satellites. This architecture increases the demand for rugged and higher speed connectivity.

NXS forms the interconnect backplane that enables a scalable satellite design using as many or as few “modular digital processors” as required, at the
same time ensuring signal integrity and high resistance to shock.

“Satellite manufacturers often use large singular printed circuit boards featuring very high-value components. The NXS Series provides them with a solderless PCB mounted connector that can be placed and replaced with very low risk to their board“ said Mark Kelleher, Vice President and General Manager of the Connector Business
Unit at Smiths Interconnect.

“The new NXS Series is designed to offer an advanced, high-density interconnect that is more compact than those currently available in the marketplace, providing next-generation data on demand,” he added.

The new NXS Series is built to the highest space standards and qualified to rigorous testing and performance criteria: ESCC 3401, ESCC 3402, ECSS-Q-ST-70C, ECSS-Q-ST-70-02,
ECSS-Q-ST-70-08C, ECSS-Q-ST-70-38C and ECSS-Q-70-71.

Equipped with the micro Hypertac® Hyperboloid contact technology, the NXS Series can withstand data rate application of up to 10Gbps requirements per channel, including extreme levels of vibration, shock and climatic testing above 2100G.

The NXS Series comes in a robust design/construction with 4 or 12 high-speed quadrax (dual-twinax) modules. Each ultra-high-density quadrax module contains 2
dual twinax at 100 O each pair. It is blind mateable, hot pluggable, with ultra-low mating forces and low outgassing materials.

In addition, the solderless PCB mount design reduces the customer’s risk and cost of ownership. The connector is mounted after reflow and has no impact on nearby components. Each product is engineered using 3D Electromagnetic Simulation (EM) software to provide excellent performance in a total thin film process.

Written By Sophia Bell

Sophia Bell is the Group Editor of DPA, Connectivity, and PBSI. She joined the team in 2020 as Assistant Editor after achieving a First-Class Honours BA in English Literature and Film Studies from the University of East Anglia. In her current role, she leads the editorial strategy, driving digital growth and ensuring each title continues to deliver trusted, relevant insight for engineering and manufacturing professionals.