Feature

Intertronics offers new conveniently packaged potting compound

From July 2021, the new IRS 3078 Polyurethane Potting Compound is available from Intertronics. The material is packaged in side-by-side cartridges, making it suitable for customers with small volume needs. IRS 3078 complements the company’s extensive range of materials and equipment for electronics bonding, potting, coating and encapsulating.

05/08/2021 12:13:41

Font size:

IRS 3078 Polyurethane Potting Compound is a semi-rigid, room temperature curing and electrically insulating black polyurethane potting compound. The material, which is low viscosity, semi-thixotropic and flowable, is available in convenient side-by-side double syringe cartridges. It offers high adhesion, good electrical insulation properties and high
impact resistance, with a resilient Shore D 65 hardness. It may also be used as a low viscosity adhesive.

The IRS3078-50KIT contains everything needed to mix and dispense the material – a 50ml cartridge of epoxy, a syringe gun and three static mixing nozzles. The material
has a 0.90:1 mix ratio by weight, a 1:1 mix ratio by volume and a viscosity of 2,000 mPas. Its working life is six minutes at room temperature. It is ideal for product evaluations or small quantity users in a range of applications including potting and
encapsulating electronic assemblies, bonding of dissimilar materials and sealing road studs.

“We recognise that every customer, and every application is different,” said Ben Swanson, Sales Manager of Intertronics. “Not only do different applications require different materials and equipment, but the way a material is packaged can
make an impact on the process and change its suitability for an application – we are launching this material with that in mind.”

To read the full specification of this material, visit https://www.intertronics.co.uk/product/irs-3078-polyurethane-potting-compound/. Alternatively, to discuss your technical requirements with a member of the team call +44 (0) 1865 842842.

Written By Sophia Bell

Sophia Bell is the Group Editor of DPA, Connectivity, and PBSI. She joined the team in 2020 as Assistant Editor after achieving a First-Class Honours BA in English Literature and Film Studies from the University of East Anglia. In her current role, she leads the editorial strategy, driving digital growth and ensuring each title continues to deliver trusted, relevant insight for engineering and manufacturing professionals.