Master Bond has introduced a flexible, tough epoxy potting and encapsulation compound called EP30FL. It has extraordinarily low viscosity, is easy to apply, and can be used in both thick and thin cross sections. This compound is 100% reactive and does not contain any volatiles. It generates low exotherm during cure even though it cures relatively quickly at room temperature. Shrinkage upon cure is exceptionally low.
Master Bond EP30FL has excellent adhesion to both similar and dissimilar substrates. Because of its flexibility, it is particularly recommended for use in environments exposed to thermal cycling. Additionally, it can withstand mechanical shock and vibration. The hardened compound has superior electrical insulation properties and resistance to water.
Master Bond EP30FL is available in ½ pint, pint, quart, gallon and 5 gallon pail kits.