Molex has introduced its new 170-circuit AdvancedMC connector for 12.5Gbps non-return to zero (NRZ) signal transmission. Molex AMC.0 B+ connectors support PICMG (PCI Industrial Computer Manufacturers Group) AdvancedTCA industry specifications for next-generation mezzanine cards and are well-suited for a wide range of applications in the telecommunications, computing and IEEE 1386 markets, as well as non-ATCA applications.
“As an industry leader in the standards arena, Molex is uniquely positioned to influence product technology improvements that support next generation demands,” said David Stevenson, product manager of Molex. “AMC.0 B+ connectors incorporate AdvancedTCA standard specifications for improved reliability, manageability and serviceability, resulting in an innovative product that allows hot-plugging of high-speed serial interconnects for advanced carrier grade equipment.”
Molex AMC.0 B+ connectors feature controlled impedance and reduced crosstalk, plus a footprint launch optimised for high-speed data rates. This enhanced footprint further reduces crosstalk by managing inter-pair affinity and incorporating additional ground bias for isolation. As a result, the connectors achieve a crosstalk of less than 3% at 12.5Gbps and deliver superior signal integrity compared to other brands.
The new connectors are made with an insert-moulded wafer press-fit design that uses very simple tooling and permits easy connector-to-PCB mounting. Unlike compression-style designs, which require gold pads and hardware, the press-fit design does not require any additional hardware for application. Featuring tin or tin-lead tail plating options, Molex AMC.0 B+ connectors support RoHS requirements and are available in three versions: standard, pegless and extended height.