Feature

New thermally conductive adhesives from Intertronics

The latest applications in energy and electrical engineering require higher levels of thermal conductivity, hence a new generation of thermally conductive two-part epoxy adhesives from Intertronics.

28/07/2016 14:28:57

These new high performance adhesives offer effective thermal conductivity, so enhancing the effectiveness of heat paths found in applications such as LED heat sink attachment, chip assembly, encapsulation, potting of thermal sensors, assembly of power module, connection of pipes in heat exchangers and the bonding and potting of battery cells and electric motors. They can help optimise production processes with a choice of accelerated thermal cures in about 15 minutes or 24 hours at room temperature.

A good example is Polytec TC 433, an advanced semi-rigid boron nitride filled adhesive. It features 2W/mK thermal conductivity and a glass transition around 110°C after thermal curing, withstanding up to 220°C continuous operation temperature.

Written By Sophia Bell

Sophia Bell is the Group Editor of DPA, Connectivity, and PBSI. She joined the team in 2020 as Assistant Editor after achieving a First-Class Honours BA in English Literature and Film Studies from the University of East Anglia. In her current role, she leads the editorial strategy, driving digital growth and ensuring each title continues to deliver trusted, relevant insight for engineering and manufacturing professionals.