From high speed signals to power requirements, Molex Copper Flex assemblies are ideal for a wide array of packaging problems, including situations where high signal speed, low loss and real estate are essential.
Designed to be significantly lighter and thinner than traditional circuit boards, Copper Flex allows products to naturally be lighter without minimising the product’s high-speed integrity. The flexible design can be bent around hardware - and even over itself - in order to fit into much smaller device enclosures. Materials used in the construction of the circuit assemblies have closely matching thermal expansion rates that allow Copper Flex to be resistant to hot and cold temperatures, as well as large temperature fluctuations. This property is essential for situations where high speed, low loss and real estate are important to maintain a system’s operational integrity.
Available in single-sided, double-sided, multi-layer and rigid flex configurations, Molex Copper Flex materials can provide a high yield of circuits using the latest instruments, which can precisely design products to fit specifications. In addition, new facility machinery allows for the transportation of ultrathin materials used in the manufacturing of advanced multilayer and rigid-flex designs, ensuring that products will assure the integrity required in the most advanced designs.