Dual-curing adhesives – full strength at only 60°C

The new range is completed by adhesives curing in a single step at low temperatures, three times faster than previous products. These epoxy resin-based adhesives are mainly used in electronics.

The new dual-curing adhesives from Delo can be prefixed after only half a second of exposure to light. Prefixing is particularly advantageous in the case of production lines, since, after dispensing and fixation, the component will be directly transferred to the next step of the process chain. This guarantees reproducibility and fast production, avoiding incidents like the slipping of individual components. Products of the DUALBOND family also feature adhesion to LCP and allow adjustment of the adhesive properties ranging from flexible to hard (elongation at tear up to 70 percent). 

Fast, faster, the fastest – very low temperature curing 

The low curing temperature of these new adhesives reduces the thermal stress between the materials, thus limiting the stress on the component. In addition to that, they allow processing of temperature-sensitive substrates without difficulty: higher temperatures would only damage the sensitive components. 

For purely low-temperature-curing adhesives, it only takes 30 minutes and a temperature of 60°C to achieve their final strength. So far, standard products have generally taken 90 minutes at the same temperature to achieve full strength. Still they are able to maintain their favourable properties such as good adhesion to plastics like LCP, PA, and PPS or flexibility on the component.