Feature

Fast-cure potting silicone for electronics assemblies

Good gap filling and sealing capacity, high durability and resistance to humidity and UV radiation are the qualities that the Loctite Si 5611 alkoxy silicone brings to electronic component assembly.

10/10/2015 11:24:03

This two-part, low viscosity silicone is designed for both bonding and sealing. The basic resin is a white liquid and the hardener is black, creating a grey liquid when combined.

A Loctite cartridge press gun with mixing nozzle ensures the efficiency of this process; standard and customised automatic dispensing equipment is also available.

As Si 5611 is also self levelling it is particularly useful as a potting silicone to protect electronic components, increasing the quality and span of their service life. Service temperature is up to 200°C.

This addition to Loctite's silicone range has been formulated for applications that require a fast cure at room temperature. For example, a full strength bond on aluminium can be typically achieved in 12 minutes on a 0.13mm gap.

Written By Sophia Bell

Sophia Bell is the Group Editor of DPA, Connectivity, and PBSI. She joined the team in 2020 as Assistant Editor after achieving a First-Class Honours BA in English Literature and Film Studies from the University of East Anglia. In her current role, she leads the editorial strategy, driving digital growth and ensuring each title continues to deliver trusted, relevant insight for engineering and manufacturing professionals.