Many small-scale devices, such as MEMS, microelectronic components and biosensors, require the bonding of different material to work properly and reliably. However, many existing bonding techniques require elevated temperatures, UV irradiation, high voltage and/or high pressure. Wafers covered with sensitive biological molecules or cells would be immediately destroyed under such conditions.Recent work carried by Dow Corning's Francois de Buyl has shown that the dual organic-inorganic character of organo-silanes includes a wide variety of molecules that react with water or moisture adsorbed on a surface to form silanols. These silanols can then react with other silanols to form a stable siloxane bond. In the presence of hydroxyl groups at the surface of glass, minerals or certain metals, silanols will form stable bondsAccording to M de Buyl, the use of organo-silanes in low-temperature bonding applications offers exciting opportunities. Dow Corning expects its research into organo-silanes will eventually yield some innovative solutions to bonding problems in these sensitive applications areas.