Power-to-board systems for rugged applications

Recently introduced by Samtec and now available through TTI, Inc., a specialist distributor of passive, connector and electromechanical components, the expanded range of PowerStrip high power-to-board interconnect systems combines high current carrying capacity with signal routing options for rugged applications.

Now available on 0.250 in. (6.35mm) pitch (PES/PET series) with signal pins on 0.100 in. (2.54mm) pitch (PESC/PETC series), PowerStrip power-to-board interconnect systems are rated for applications up to 28A at 80° C and have up to 8 blade style contacts. 40 signal pins are standard and can handle up to 3A of current at 80° C.

Suitable for parallel board spacings of 19mm and for perpendicular and coplanar board interface applications, polarised, through-hole PowerStrip connectors are RoHS-compliant and suitable for lead-free processing. Right-angle versions benefit from screw-down features for added ruggedness.

Samtec offers a broad line of power and combination power/signal interfaces for board-to-board and wire-to-board applications.

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