Schroff UK has published a new brochure outlining its range of electronics packaging solutions for systems based on the emerging AdvancedTCA, AdvancedMC and MicroTCA specifications. In no less than 48 pages, this full-colour document provides a useful introduction to the three specifications, which are fast gaining favour in the telecoms sector as network systems move to modular, standards-based architectures.
As well as describing the mechanical requirements and benefits of each specification, the brochure contains key technical information on Schroff’s product range, which includes complete systems, subracks, backplanes, front panels, power supplies and thermal management solutions. Further technical details for each product are available by simply entering the relevant ‘oneClick’ code on the company’s website.
Schroff UK has also introduced a development system designed to provide engineers with a quick and easy way of evaluating MicroTCA technology (which allows AdvancedMC modules to be plugged directly into a backplane without the need for a carrier). There’s a choice of two sizes - a 6U version with a single-module card cage and an 8U version with a double-module card cage, which can also accommodate single modules using a splitter kit.
Housed in Schroff's ratiopacPRO desktop case, each development system includes a 200mm-deep card cage with plastic card guides, built-in active cooling using hot-swappable fan modules, and a MicroTCA backplane. The card guides can be placed anywhere on the 1HP (5.08mm) grid of card cage, ensuring that different sizes of AdvancedMC modules can be assembled together within the same unit.
The backplane can accommodate up to ten AdvancedMC modules (eight full-size and two mid-size), as well as providing two MicroTCA carrier hub slots andtwo power module slots. Employing dual-star topology, the backplane also includes S-ATA/SAS direct connections between individual slots for the operation of hard-disk drives.